PRESS RELEASE – On the August 22, LG Innotek (CEO Moon, Hyuksoo) introduced that it’s going to companion with Ansys, the world’s high engineering simulation firm, to develop the applying of ‘Digital Twin’ know-how to all its processes.
‘Digital Twin’ is a know-how that replicates objects in a digital house to foretell the outcomes of potential real-life conditions via laptop simulations. It’s heralded as a know-how able to fixing varied industrial and social issues. Specifically, it’s being quickly deployed within the manufacturing business as it may cut back product growth time and prices.
Ansys is understood to own world-leading know-how and deployment expertise within the subject of simulation utilizing 3D modeling, Synthetic Intelligence (AI), and Machine Studying (ML). By collaborating with Ansys, LG Innotek will be capable of leverage its newest ‘Digital Twin’ options and simulation software program to construct a state-of-the-art ‘Digital Twin’ atmosphere.
In collaboration with Ansys, LG Innotek carried out a trial software of its ‘Digital Twin’ know-how to some growth and manufacturing processes and has achieved tangible outcomes. Sooner or later, the corporate plans to develop the applying of ‘Digital Twin’ to the event and manufacturing processes of its complete product vary, together with autonomous driving elements equivalent to car connectivity and sensing units.
Preliminary verification of designs utilizing digital simulation, decreasing growth time by 99%
LG Innotek is reaping the advantages of its ‘Digital Twin’ in R&D. After verifying designs in a digital atmosphere, the corporate makes use of the info to attenuate the variety of checks that must be carried out and the time it takes to conduct them.
It utilized ‘Digital Twin’ know-how to the event of bundle substrate (PS) merchandise for semiconductors, managing to cut back the event time by 99%.
Substrates require the minimization of ‘Warpage’ because of the warmth and stress to which they’re uncovered throughout manufacturing. That is achieved via a simulation course of that optimizes the mixture of the circuit design construction and supplies composition ratio. Utilizing digital simulation via 3D modeling, LG Innotek has lowered the time required to foretell the diploma of ‘Warpage’ of a single substrate from 11 days to three.6 hours.
Growing deployment of ‘Digital Twin’ to FC-BGA and digital element manufacturing processes, maximizing manufacturing competitiveness
LG Innotek has expanded the applying of ‘Digital Twin’ know-how to not solely product growth but in addition the FC-BGA (Flip-Chip Ball-Grid Array) manufacturing course of. Utilizing this know-how, the corporate has succeeded in halving the ramp-up interval (enhance in manufacturing capability by enhancing yield within the early phases of mass manufacturing) by establishing optimum situations for the FC-BGA manufacturing tools.
Previously, the corporate needed to conduct a whole bunch of checks to determine the optimum FC-BGA course of situations, which relied closely on money and time. Utilizing 3D modeling, it has replicated the FC-BGA manufacturing course of in a digital house.
Operating the method in a digital house permits the pc to visualise and determine issues that would happen with varied course of tools. This makes it potential to meticulously optimize situations, such because the circulate of liquids, warmth, and air that can’t be measured inside such tools.
As well as, LG Innotek has managed to extend productiveness by actively utilizing ‘Digital Twin’ within the manufacturing technique of digital car elements. Since digital car elements have a protracted product lifespan and are extremely susceptible to the climate, making certain high quality and reliability is essential.
LG Innotek utilized ‘Digital Twin’ know-how to the soldering course of, which is a key course of for making certain the reliability of digital car elements. The soldering course of was simulated in a digital house to foretell the time it takes for the solder to crack. By optimizing course of situations equivalent to the quantity of solder utilized and nozzle design to delay cracking as a lot as potential, the corporate plans to extend productiveness by 40% in comparison with the earlier course of.
“LG Innotek to change into a ‘meta-manufacturing’ firm by advancing Digital Twin know-how”
By way of its partnership with Ansys, LG Innotek plans to quickly develop the usage of ‘Digital Twin’ know-how to all product strains and processes, together with new development companies equivalent to car communication modules and LiDAR (mild detection and ranging) units.
Sooner or later, the corporate plans to develop the usage of ‘Digital Twin’ know-how to prospects and companions throughout the whole worth chain, from growth to manufacturing. Because of this, companions and prospects will be capable of collaborate on product design and simulate the effectivity of manufacturing processes on the digital ‘Digital Twin’ platform constructed by LG Innotek.
The entire information generated within the digital house shall be collected in actual time and used to enhance product design and buyer processes. All information from LG Innotek, its companions, and prospects shall be organically linked and shared in actual time, enabling systematic high quality management and environment friendly growth.
Moreover, AI shall be utilized to the digital design and high quality course of verification to extend simulation velocity and accuracy. AI will be taught from the info collected via simulation to derive optimum options and assist decision-making by engineers. LG Innotek believes the productiveness features shall be multiplied by combining the strengths of virtualization and AI know-how.
LG Innotek Chief Know-how Officer S.David Roh mentioned, “The long run we envision at LG Innotek is meta-manufacturing, the place simulation outcomes from a digital house are linked to bodily manufacturing services and routinely result in precise manufacturing.” He added, “To this finish, we’ll quickly apply superior ‘Digital Twin’ know-how to the whole worth chain, together with R&D, manufacturing, and high quality management, to create differentiated buyer worth.”
